Electronics Packaging Engineer

Job Description

COVID-19 continues to significantly impact our employees, families and communities. With employee health and safety as our top priority, and as a federal contractor, Lockheed Martin is taking action to address the increased risk and uncertainty COVID variants pose in the workplace and ensuring we meet our commitments to national security.
As directed by Executive Order 14042: Ensuring Adequate COVID Safety Protocols for Federal Contractors, all current and newly hired employees, in the United States, are required to be fully vaccinated by January 18, 2022.
Description:As the Electronics Packaging Engineer, you will be responsible for the mechanical design of Radar system equipment including preliminary design, detailed design and analysis, design documentation, procurement support, manufacturing support, test support and environmental testing of electronic packaging hardware. Support proposals including generating labor and material cost estimates, generating schedules, and identifying risks, opportunities and risk mitigation strategies. Providing program status and generating design review material in clear and concise presentations and/or documents for review by management and customers. Use of engineering tools to perform design and analysis tasks.
Basic Qualifications:
• BS in Mechanical Engineering or Physics with a minimum of 2 years' experience in the design and analysis of electronic equipment.
• Possess knowledge of material properties used in electronic packaging and knowledge of packaging thermal management techniques.
• Experience using 3D solid modeling (PRO-E preferred) tools to develop and iterate complex hardware designs
• Self-motivated with strong verbal and written communication skills.
• Ability to acquire & maintain a security clearance at the SECRET level.
Desired Skills:
• MS in Mechanical Engineering or Physics
• Experience using finite element analysis (ANSYS preferred) tools to develop and iterate complex hardware designs
• Experience in packaging of microelectronics
• Experience in advanced packaging techniques (e.g. flip chip, 2.5 and 3D)