Packaging Hardware Engineer, Quantum AI

Job Description

Qualifications

Minimum qualifications:

• Bachelor's degree in a technical field or equivalent practical experience
• Experience with electronics packaging, including process development and monitoring
• Experience developing and execute design of experiments (DOEs) and writing technical documentation
• Experience with a scripting or programming language

Preferred qualifications:

• Experience working in a production environment
• Experience developing wire bond processes and working with automated wire bonders using fine wire (≤1 mil diameter)
• Experience with electronic, RF and/or cryogenic materials and properties
• Proficiency in wire bond related inspections/verifications (MIL-STD-883) and root cause failure analysis
• Proficiency with Python

About the job

The Quantum team's mission is to make useful quantum computing tools available to the world to enable humankind to solve problems that would otherwise be impossible. Google AI Quantum is building novel systems that can leverage quantum mechanics to outperform the world's largest computers at certain classes of problems.

In the device packaging group, we build custom packaging technologies for quantum processors, amplifiers, and other devices that operate from DC to microwave frequencies in a cryogenic environment. Our work includes research on quantum processor performance and qubit environment, design of novel packages and test articles, investigation of new technologies, and hardening of new technologies for deployment. Every Google QuantumAI processor comes through our lab for packaging before its deployment to the fleet.

This packaging engineer is responsible for aspects of packaging research and flagship processors, including the packaging process, assembly/metrology tools, and design tools. You will be responsible for the execution, maintenance, improvement, and development of the packaging processes on which our research program relies. Collaborating with researchers, project managers, software engineers, and other packaging engineers, you will transition new technologies to production, establish design rules on existing technologies, and strengthen process reliability.

Responsibilities

• Package boutique flagship and research quantum processors, and write documentation to transition new designs into production
• Develop, improve, and document processes for the packaging of cryogenic microwave devices
• Execute design of experiments (DOE) to establish design rules on current processes
• Use existing process technology nodes to design packages and test articles, collaborating with researchers and engineers across the team
• Work with software engineers and technical program manager to maintain design tools and cleanroom tools

Location

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