IC Packaging Technologist Lead

Job Description

Due to the current health crisis related to COVID-19 and the escalating visa/travel restrictions in place, we're currently unable to extend offers to anyone who cannot work from Taiwan due to lockdown visa/travel restrictions, or other restrictive measures until further notice. Consequently, we will be prioritizing candidates who can start in this location by set date as expected. We're keeping the situation under review and would adjust our position should the restrictive measures be removed later on.

Qualifications

Minimum qualifications:

• MS degree in Mechanical Engineering, Materials Science or equivalent practical experience.
• 10 years of experience in IC packaging technology development.
• Experience in packaging assembly, substrate, reliability, failure analysis and etc.
• Data analysis and problem solving experience. Communications experience to drive cross-functional initiatives.

Preferred qualifications:

• PhD in Mechanical Engineering, Materials Science and equivalent engineering experience.
• Extensive working experience with foundries and OSATs to bring SoC packaging to production.
• Working knowledge of packaging design, electrical, thermal and mechanical analysis, system level integration, performance vs cost trade off.
• Proven track record in advanced packaging technologies development such as wafer level packaging, 2.5D/3D die stacking.

About the job

Our computational challenges are so big, complex and unique we can't just purchase off-the-shelf hardware, we've got to make it ourselves. Your team designs and builds the hardware, software and networking technologies that power all of Google's services. As a Hardware Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of Google users.

Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.

Responsibilities

• Lead packaging integration efforts and working with cross-functional teams to define.
• Initiate and drive advanced packaging technology development from concept to mass production.
• Drive IC packaging industry with innovations, new packaging solutions, methodology and specifications.
• Multi-task on different projects and mitigate program risks.

Location

Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing this form .

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