Micron’s vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
Req. ID: 227681
Our vision is to transform how the world uses information to enrich life. Join an inclusive team passionate about one thing: using their expertise in the steadfast pursuit of innovation for customers and partners. The solution we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while supplying to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Do you strive in a multifaceted work environment? We are looking for highly motivated and dedicated individuals to join us as in our Package Development Engineering Team!
As Package Development and Engineering (PDE) Technology Development (TD) Process Integration Engineer (PIE) at Micron Technology, Inc., you will be responsible for integrating various technology development program and projects to make sure timely and satisfactory results are achieved and aligned to the technology roadmap and commitments of PDE. This involves integrating the whole technology development program that supports the customer & product roadmap and task and work at project level on assigned projects.
Technology Development Program and Project Integration
We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.
Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms, Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPointTM memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form
Keywords: India || Telangana (IN-TG) || India (IN) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-NB2 || Tier 4 ||
About Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
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