Package Reliability Engineer (Open for fresh graduates)

Job Description

Req. ID: 198303

As a GQ (Global Quality) Package Reliability Engineer in the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron’s product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced; and providing recommendations on product release based on package reliability test results. You will also be expected to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMAs (failures from customers), and prepare reports for discussion with stakeholders. Additional duties include providing support to internal and external customers for package-related quality and reliability issues, and customer requests.

Responsibilities and Tasks

Manage Regulation for New Product Qualifications

• Coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced
• Provide holistic qualification plans for new developments
• Provide recommendations on product release based on package reliability test results

Design and Implement Reliability Test Plans

• Devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues
• Provide advice for proper screen method for quality concerned lots
• Sustain proper monitoring methodology for quality

Regulate Root Cause and Corrective Action Plans

• Lead 8D report processes
• Coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMAs (failures from customers)
• Prepare reports for discussion with stakeholders

Act as a liaison for both Internal and External Customers

• Evaluate whether internal and external customer requests are reasonable and acceptable for Micron quality policy
• Provide technical support for package-related quality and reliability issues
• Supply technical expertise for customer requests

Requirement

• Bachelors Degree in Electronics / Materials Sciences / Mechanical or any related field of study
• Thorough knowledge of semiconductor component package assembly processes and challenges
• Knowledge of surface mount processes and challenges
• Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies
• Good understanding of the effects thermomechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability
• A working knowledge of industry standard reliability test methods of package level and board level, acceleration models used for life predictions, and sampling statistics preferred
• Must be self-motivated, able to work independently, and detail oriented
• Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups
• Good written and verbal communication skills in English and computer skills are necessary
• Ability for other Asian languages, especially Chinese and Japanese, can be a plus
• Working knowledge of the software systems employed in backend manufacturing
• Understanding of statistics and quality management (SPC, FMEA, 8D CAR, etc.)

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords: Penang || Pulau Pinang (MY-07) || Malaysia (MY) || Quality || College || Regular || Engineering || #LI-EA1 || Tier 3 ||