Job Description
Job ID: JR0114045 Job Category: Engineering Primary Location: Hsinchu, HSZ TW Other Locations: Job Type: Experienced Hire
NAND Component Quality & Reliability Engineer
Job Description - The candidate will join NSG Quality & Reliability team for product quality & reliability development engineering and manufacturing support of NSG's high performance, revolutionary NAND Flash component.
- The primary responsibility is to plan & execute NAND Flash reliability demonstration test with the target to identify and resolve component failures for new generation of Intel NAND Flash.
- Perform failure analysis & risk assessment for failure detected from qualification process & drive solution to make sure product meet Intel & industry requirements.
- Secondary responsibility include work with OSAT factory on quality & reliability test measurement implementation in manufacturing, maintain high volume manufacturing continue to meet quality & reliability standard.
- The person will identify fail modes, complete electrical FA on module and/or components to understand the root cause and provide containment and fixes.
- He/she will use appropriate tools such as bench testers, oscilloscope, and other test systems to do NAND component level/and or SSD level failure analysis and debug.
- The person will closely work with NSG team and other partners e.g. Product Engineering, Systems Engineering, Test Engineer, Design Engineer, Firmware, Material, and NSG's OSAT/ODMs, etc. to ensure adequate quality/reliability of Intel-branded NAND Flash component. Performs other related duties as required or as directed.
Qualifications
- You must possess a Bachelor of Science degree or a Master of Science degree preferably in Electrical Engineering, Computer Science or an applicable technical degree.
Additional qualifications include:
- Fluent Oral/Written English.
- Good at digital/analog circuit knowledge and/or good test methodology coding and/or failure analysis experience.
- Failure analysis or Process/Product development experience on Flash Component is a Solid Plus
- Knowledge of entire Semiconductor Fabrication & Test flow Fab, Sort, Assembly, Test, Q&R would be an added advantage
- Experience with PC System, SSDs or HDDs would be a plus
- Quick Learning Skills.
- Good teamwork and the ability to work well with both internal/external teams from US and Asia.
- Regular travel which may include extended stay in the US or Asia.
Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth